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服務能量

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我們將協助系統整合與產品製造廠商依據其產品內之電子元件雜訊影響效應,建立符合EMC要求之系統雜訊預算與其內各元件之初步EMC限制值,以協助系統工程於設計之初即能掌握EMC規範與性能之要求,應用及服務為目標的各種雜訊預算管制,未來將可應用在提供全球各資通訊廠商其產品之改良方向,以協助各國內資通訊廠商執行各種模組之雜訊預算管制。

 

 

各項測試方法

IC-EMI量測方法簡介

Part1:IEC 61967, measurement of emission

IEC 61967-1

ED 1.2 2002-3

General conditions and definitions : 1 GHz

IEC 61967-1-1

Draft (Freescale)

Near-Field scan data

exchange format.

IEC 61967-2

ED 1.0 2005-9 (SAE)

TEM / GTEM : 1GHz

IEC 61967-3

ED 1.0 2005-6

Surface scan : 1GHz

 

 

 

 

IEC 61967-4

ED1.1 2006-7 (VDE)

1 ohm/150 ohm direct coupling : 1GHz

IEC 61967-5

ED 1.0 2003-2

(Philips)

Workbench Faraday Cage (WBFC) : 1GHz

IEC 61967-6

ED 1.1 2008-6 (NEC) Magneti  probe (MP) : 1GHz

IEC 61967-8

CCDV

IC stripline : 10GHz

 

 

 

 

IC-EMS量測方法簡介

Part2: IEC 62132, measurement of immunity

IEC 62132-1

ED 1.2 2006-1

General conditions and definitions : 1 GHz

IEC 62132-2

ED 1.0 2010-3 (SAE)

TEM / GTEM : 1GHz

IEC 62132-3

ED 1.0 2007-9

Bulk current injection (BCT) : 1GHz

IEC 62132-4

ED 1.0 2006-2

Direct RF power injection (DPI) : 1GHz

 

 

 

 

IEC 62132-5

ED 1.2 2005-10

(Philips)

Workbench Faraday Cage (WBFC) : 1GHz

IEC 62132-6

ANW

Local Injection Horn Antenna

(LIHA) : 10GHz

IEC 62132-8

ACDV

IC stripline : 5GHz

IEC 62132-9

Planed

Near Field San immunity(NFS) : 10GHz

 

 

 

 

 

EMC 課程規劃

Item

Topic

IC-EMC

Part I

1. Chip level IC trend and basic principles of EMC

2. Chip level IC-EMC related standards and measurement technology analysis

3. OTA and Throughput Measurement Techniques

4. EMC design analysis and case study of wireless communication system

5. Automotive Electronics EMC Design Analysis and Case Study

IC-EMC

Part II

1. Application of IC-EMC limit value planning and noise estimation for system integration

2. Analysis of IC-EMC design criteria

3. IC-EMC model analysis

4. Case Analysis of IC-EMC Design Technology

5. Shielding material measurement techniques and applications

PCB EMC

1. High-Speed Digital Design Trend

2. Digital Noise Spectrum Analysis and Coupling Mechanism

3. Power Integrity Analysis and Design Techniques

4. Signal Integrity Analysis and Design Techniques

5. Electromagnetic Compatibility Design Techniques from System Integration Prospect

6. Radio Frequency Interference Analysis and Design Techniques for Mobile Devices

7. PCB Design Methodology for High-Speed Digital Design

Compliance Testing and Design for Product EMC

1. FCC Part 15B and Part 18 testing requirements

2. EN 55032 and EN 55022 EMI & IEC 61000-4-x EMS testing requirements

3. Product Design Techniques for EMC Compliance: Cabling,Filtering, Shielding